| 摘要 |
PURPOSE:To provide the title fluid which enables the removal of a polyimide precursor composition spreading to the rear of, e.g. a semiconductor substrate when the composition is applied by spincoating to the substrate and to provide a method for cleaning by using the fluid. CONSTITUTION:The fluid contains N,N-dimethylformamide and methyl alcohol, the content of the former being 70-85wt.% based on the total of the former and the latter. When a polyimide precursor composition is applied by spincoating to the surface of a substrate, the fluid is used to clean the end on the rear of the substrate. |
