| 摘要 |
PURPOSE:To provide a brazing filler metal for joining ceramic and metal and its joining method for use at producing a substrate of electronic parts. CONSTITUTION:A brazing filler metal for joining ceramic and metal having a composition consisting of, by weight, 47-66% silver and 34-53% indium is used for joining ceramic and metal at 500-650 deg.C. Thus, this is applicable to a low temp. firing ceramic, which is fired at 850-1000 deg.C, not to impair the strength characteristic of substrate, also, it brings about the effect at subsequent process of not disconnecting metal leads at die bonding. |
