DEVICE FOR GRINDING ARTICCE IN PLANE FORM

摘要

PURPOSE: To provide a polishing machine in which the life of polishing slurry is lengthened to reduce the number of times of replacement for the slurry as much as possible. CONSTITUTION: This polishing device for a plane article has an agitator for ultrasonically agitating polishing slurry 15 in a second position adjacent to a wafer 12 in loading a first position of a rotatable polishing pad 11 covered with polishing slurry 15 with a plane article (wafer) 12 to be polished, rotating the wafer 12 and polishing the wafer 12, and grit (used abrasives to be discarded) is removed from the polishing pad 11 surface by the agitator.