| 发明名称 |
Heat-resistant bonding materials |
| 摘要 |
Heat-resistant bonding materials are composed of a polyimide precursor end-capped at molecule ends thereof and/or an imide compound formed from the polyimide precursor. They may also contain fine particles of at least one material selected from metals, metal oxides, metal carbides and metal nitrides.
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| 申请公布号 |
US5280102(A) |
申请公布日期 |
1994.01.18 |
| 申请号 |
US19900500503 |
申请日期 |
1990.03.28 |
| 申请人 |
HITACHI, LTD.;HITACHI CHEMICAL CO. |
发明人 |
MATSUYAMA, HARUHIKO;SHOJI, FUSAJI;HONDA, ATSUSHI;AIZAWA, TERUKI |
| 分类号 |
C09J179/08;H01B3/30;(IPC1-7):C08G73/10;C08G8/02;C08G69/26 |
主分类号 |
C09J179/08 |
| 代理机构 |
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