发明名称 Semiconductor having diffusion region separated from the gap electrode and wiring layer
摘要 A method of manufacturing a semiconductor device includes the steps of: forming a gate electrode and a wiring layer on a silicon oxide film formed on the surface of a semiconductor substrate, by using conductive material; forming a diffusion region on the surface of the semiconductor substrate by implanting impurities into the semiconductor substrate at an area other than the gate electrode and the wiring layer; and forming a film for electrically interconnecting the diffusion region and the wiring layer, using conductive material.
申请公布号 US5279979(A) 申请公布日期 1994.01.18
申请号 US19920885768 申请日期 1992.05.20
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SHINO, KATSUYA;MAEDA, KOUSHI
分类号 H01L21/28;H01L21/285;H01L21/336;H01L29/78;(IPC1-7):H01L21/266 主分类号 H01L21/28
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