发明名称 |
Au-Sn transient liquid bonding in high performance laminates |
摘要 |
A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, multilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.
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申请公布号 |
US5280414(A) |
申请公布日期 |
1994.01.18 |
申请号 |
US19900536145 |
申请日期 |
1990.06.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP. |
发明人 |
DAVIS, CHARLES R.;HSIAO, RICHARD;LOOMIS, JAMES R.;PARK, JAE M.;REID, JONATHAN D. |
分类号 |
H01R43/02;B23K35/00;B23K35/30;H01R4/02;H05K3/28;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H05K3/36;H05K1/11;B32B31/00 |
主分类号 |
H01R43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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