发明名称 HIGH-PRECISION GRINDING AND CUTTING DEVICE AND METHOD THEREWITH
摘要 PURPOSE:To provide a high-precision grinding device and its grinding and cutting method which have high flatness of a cut area and are capable of reducing a deformation of a processing distortion. CONSTITUTION:Synchronously with reciprocation of an X table 1 in the direction of X, a Y table (rotary table) 3 provided through a tilting table 2 is turned by 180 deg.. A work 4 mounted on a rotary table 3 is cut off by a grindstone 7 which is joined to a Z table and grindstone shaft 6 which is lowering similarly in a Z direction synchronously with a movement of the X table 1 by grinding alternately both sides of a cutting groove by only an arbitrary one face of the grindstone 7 so that only the arbitrary one face of the grindstone 7 contributes always to cutting. At the time of the cutting, a fixed tilting angle theta(normally within 1 deg.) is set up within a YZ face. With this construction, cutting resistance to be applied to both the sides of the cutting groove can be balanced and a processing distortion can be made uniform. This device is suitable for cutting of a material which is thin and has high hardness and a thin film magnetic head, which has high reliability and is for high density record reclaiming, can be realized.
申请公布号 JPH068233(A) 申请公布日期 1994.01.18
申请号 JP19920170439 申请日期 1992.06.29
申请人 HITACHI LTD 发明人 FUKAZAWA KATSUYA;IMAYAMA HIROTAKA;FUJISAWA MASAYASU;TAKESHITA KOJI
分类号 B24B27/06;B28D1/24;B28D7/04;G11B5/31;(IPC1-7):B28D1/24 主分类号 B24B27/06
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