CERAMIC PACKAGE AND SEMICONDUCTOR DEVICE

摘要

PURPOSE:To manufacture a low-cost ceramic package having conductor patterns at a fine pitch and to provide a semiconductor device having excellent characteristics. CONSTITUTION:A conductor pattern 12 to be electrically connected to a semiconductor chip 30 to be placed on a ceramic board 10 is formed as a thin film on one side surface of the board 10, and connecting leads 16 for mounting a package are connected to ends of the pattern 12 extended up to the one side surface of the board 10.