| 摘要 |
PURPOSE:To provide a multilayered printed wiring board constituting one board for making a package of a mixture of on-board high and low frequency circuits small that is good for workability such as less brasion of drill, that is relatively low cost, and that has a superior dielectric characteristic on the micro-strip lines of the high frequency circuit. CONSTITUTION:In a multilayered printed wiring board 9 formed to have micro- strip lines on at least one outermost layer L1 and to be equipped with a mixture of a high frequency circuit 9a and low frequency circuits 9c, a dielectric between the signal lines from the micro-strip lines on the outermost layer L1 and a conductor on the reference surface of a layer L2 next to the outermost layer L1 consists of dielectrics with a frequency of 1GHz-15GHz, a dielectric constant of 3, and a dielectric tangent of less than 0.05, while dielectrics in other inner layers are made of glass-cloth based epoxy resin. |
