发明名称 ALUMINUM NITRIDE CERAMIC BOARD
摘要 PURPOSE:To solve warpage occurring at the time of sintering and to improve heat dissipation by forming a metallized layer made of tungsten, etc., on one side face of AlN ceramics and a high melting point metallized layer made of tungsten, etc., on an opposite side face by forming them of double layers with a ceramic layer made of AlN. CONSTITUTION:A high melting point metallized layer 2 containing tungsten or molybdenum as a main ingredient is formed on one side face of AlN ceramics 1, and a double layer is formed on its opposite side face of the layer 2 and a ceramic layer 3 containing AlN as a main ingredient to cover the layer 2. Thus, both the faces of the ceramics 1 are metallized to cancel a stress due to sintering.shrinking of the metallized layer and to reduce its warpage. Since a rear metallized surface is covered with the layer 3, a disadvantage of wrong heat dissipation in the atmosphere and to a component to be connected can be solved.
申请公布号 JPH065736(A) 申请公布日期 1994.01.14
申请号 JP19920183026 申请日期 1992.06.16
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SHIMODA KOHEI;NAKADA HIROHIKO
分类号 C04B35/581;C04B35/58;H01L23/15;H05K1/03 主分类号 C04B35/581
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