SEMICONDUCTOR WAFER, CHIP, PICK UP METHOD OF THE CHIP, SEMICONDUCTOR DEVICE, AND FABRICATION THEREOF

摘要

PURPOSE:To eliminate crack between a chip and a protective film for circuit pattern formed thereon by providing the protective film for the circuit pattern and regions for splitting a wafer into a plurality of chips arranged longitudinally and latitudinally. CONSTITUTION:A protective film 111 is provided in a split region 112 in the short side direction of a line sensor chip 115 with same width as the split region 112. The protective film 111 is deposited through same process as depositing a protective film 113 for an electric circuit pattern 108 formed on the line sensor chip 115 while simultaneously therewith. In a semiconductor wafer formed in particular with the protective film 113 for the circuit pattern 108, the protective film 113 is deposited such that the end part 114 thereof is located between the breadthwise end part of the split region 112 and the end part of effective split part. Since the protective film 113 is not arranged at an edge part of the chip 115 contacting with a collet 104 in the stage of semiconductor wafer, the protective film 113 is protected against direct contact with the collet 104.