| 摘要 |
<p>PURPOSE:To provide a semiconductor wafer dicing method and especially a blade cooling method, where a dicing blade is elongated in service life preventing it from being charged with electricity in dicing. CONSTITUTION:Pure water is spouted out from the end faces of flanges 3 which sandwich a dicing blade 2 to cover the periphery of the side faces of the blade 2 with pure water films, and carbonated water is spouted out from a shower nozzle 6 against a cutting spot, whereby a wafer 1 is cut out by the dicing blade 2.</p> |
