| 摘要 |
PURPOSE:To cover flatly a recessed site in surface layer through holes and to obtain a highly reliable printed wiring board, on which a surface mounting component can be mounted directly, in a laminated board having each surface layer through hole in its mounting pads for surface mounting component mounting. CONSTITUTION:In a laminated board 10 having surface layer through holes 2, a recessed resin layer 6a is first formed in the holes 2. Then, a conductive resin 3 is filled in the layer 6a and the layer 6a is mechanically made flat. Then, after a plated layer 8 is applied on the surfaces of the board 10, pads 1 for mounting, with which the holes 2 are respectively covered, are formed simultaneously with wiring patterns 7a by a patterning process. Thereby, at the time of mounting of a surface mounting component, solderability is stabilized and the inclination of the component, an unfinished soldering and the like can be prevented from being generated. |
