SINGLE WAFER TYPE DRY ETCHING DEVICE AND SINGLE WAFER TYPE DRY ETCHING METHOD USING THE DEVICE,申请号JP19920162530-传众专利搜索

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发明名称	SINGLE WAFER TYPE DRY ETCHING DEVICE AND SINGLE WAFER TYPE DRY ETCHING METHOD USING THE DEVICE
摘要
申请公布号	JPH065564(A)	申请公布日期	1994.01.14
申请号	JP19920162530	申请日期	1992.06.22
申请人	MITSUBISHI ELECTRIC CORP	发明人	KUME SATOSHI
分类号	H01L21/302;H01L21/3065;(IPC1-7):H01L21/302	主分类号	H01L21/302
代理机构		代理人
主权项
地址

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