| 摘要 |
PURPOSE:To provide a low melting point metal joined type anisotropic conductive film which can be thinned by dispersing a low melting point metal and a conductive particle having a melting point higher than that of the metal into an electrically insulative resin sheet, and heating the sheet above the melting point of the low melting point metal. CONSTITUTION:A low melting point metal 3 having a melting point of 300 deg.C and a conductive particle 4 having a melting point higher than that of the metal 3 are dispersed in an electrically insulative resin sheet 2. A particle diameter of the low melting point metal 3 is 0.1-100mum, more preferably 0.5-50mum; and that of the conductive particle 4 is 0.1-50mum, more particularly 1-10mum. A volumetric ratio of added amounts of the metal 3 and the particle 4 is set to 9/95-95/5. A thickness of the sheet 2 is 10-200mum, more particularly 20-100mum. The sheet 2 is heated above the melting point of the low melting point metal 3. Consequently, the metal 3 adheres to the conductive particle 4. With further heating, the metal 3 is joined with the particle 4, thus providing anisotropic conductivity for an electrically conductive passage 5. |
