| 摘要 |
PURPOSE:To reduce in size a semiconductor device by so filling arm electronic component in a box-shaped case as to seal the component and to cure it with epoxy resin component and particular filler component of special amounts and to specify a linear expansion coefficient after curing to a special range. CONSTITUTION:An element 6, a wire 7 and an electrode terminal 2 are mounted inside a case 4 having a base plate 5. 10-30wt.% of epoxy resin component and 80-70wt.% of particular filler component are so contained as to seal the components, and resin 1 having 5X10<-6>-25X10<-6> of linear expansion coefficient after curing is filled in the case 4. Thus, the component is directly sealed with the resin, reduced in size, a material cost can be decreased, and the steps of filling.curing gel are eliminated thereby to provide easy manufacture. Since generation of a stress of the resin is small, an S bent of the terminal 2 can be omitted. |
