| 摘要 |
PURPOSE: To connect an external lead to a substrate, without generating a bridge between contacts on a substrate for external lead of a surface mounted type semiconductor device. CONSTITUTION: A coating layer 2 and a solder layer easily isolated and formed of a nickel or chromium coat an upper part 34 of a package lead. When heat is applied to an end 32 for substrate mounting of the lead, solder is released from an easily released layer 24, fed down at the lead to arrive at a contact pad 40 on a mounting board 42 to form a solder junction 46. An amount of the solder to be supplied to the joint to form the junction is decided, according to the thickness of the adhered solder layer which covers the package leads. |
