| 摘要 |
<p>PURPOSE:To realize normal and stabilized operation of a plurality of semiconductor elements being packaged for a long term. CONSTITUTION:The package for semiconductor element comprises an insulating base body having semiconductor element 3 mounting parts on the top and bottom faces thereof, cover bodies 2 to be applied on the mounting parts 1a, and inner space for housing semiconductor elements 3, wherein irregularities are provided on the side face of the insulating base body.</p> |
