| 摘要 |
PURPOSE:To obtain good bonding characteristics without complicating the manufacturing process and to make it possible to obtain a highly reliable wiring. CONSTITUTION:A semiconductor device is manufactured into a constitution, wherein a bonding pad 46, which is formed on a semiconductor substrate 21 along with semiconductor elements (a MOS transistor 41 and a memory cell 45), is formed on two polysilicon layers 28 and 30 laminated simultaneously with a polysilicon layer for forming gates 40, 43 and 44 of the semiconductor elements, whereby there is no need to add a process for forming newly the polysilicon layers and a process of manufacturing the device is not complicated. Moreover, as the pad 46 is formed on the two polysilicon layers, absorption of mechanical force is performed by the polysilicon layers even if wires are bonded on the pad, there is no possibility that the wires are exfoliated from the pad with time, good bonding characteristics are obtained and a highly reliable wiring is obtained.
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