| 摘要 |
<p>PURPOSE:To provide an evaluation semiconductor device which is able to evaluate a package of any size so as to cope with a case where the package manufactured corresponding to a semiconductor device which is altered in size at a design stage is changed in size. CONSTITUTION:An active region of a semiconductor device where evaluating elements are formed is demarcated and separated into regions by scribe lines 102a, 103a,... formed in a lattice, and one or more bonding pads 10 are arranged on each of the regions. An evaluating element composed of a transistor 120, a diffusion layer resistor 121, and others is formed on a region demarcated by scribe lines, whereby a bonded part is evaluated in both physical and electrical connection state. This evaluating semiconductor device is diced along scribe lines so as to be as large in size as a semiconductor device housed in a package.</p> |
