发明名称 Verfahren zur Herstellung einer elektrischen Durchgangsverbindung unter Verwendung eines lötbaren mechanischen Halters.
摘要 A method for providing an electrical connection (via) between the top and bottom of a printed circuit board (PCB) is presented. An eyelet (10) extends through a hole (25) in the PCB. The top of the PCB has a first conductive layer (23). Around the hole the first conductive layer is shaped such that a conductive pad (24) is isolated from the rest of the first conductive layer, except that spokes of the first conductive layer extend from the conductive pad (24) to the rest of the first conductive layer (23). The eyelet is crimped such that crimped fingers or tabs (31-36) of the eyelet cause the eyelet to be mechanically retained in the hole. The tabs are curved so that the tabs do not lie flat upon the conductive pad. The bottom of the PCB is then wave soldered so that a base of the eyelet is electrically coupled to a conductive layer on the bottom of the PCB and the tabs are electrically coupled to the conductive pad.
申请公布号 DE3881378(T2) 申请公布日期 1994.01.13
申请号 DE19883881378T 申请日期 1988.12.30
申请人 HEWLETT-PACKARD CO., PALO ALTO, CALIF., US 发明人 MACKONIC, JAMES C., ROCKLIN CA. 95677, US;LELKO, DAWN MARIE, CITRUS HEIGHTS CA.95610, US;SHUGART, STEVEN ALMON, ROCKLIN CA. 95677, US;KOCH, JAMES K., ROCKLIN CA. 95677, US
分类号 H05K1/02;H01R12/51;H05K3/34;H05K3/40;H05K3/42;(IPC1-7):H05K3/42;H01R9/09 主分类号 H05K1/02
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