Mechanical in situ curometer.

摘要

An in situ curometer has been developed to follow the cure of thick articles during molding, by measuring continuously the dynamic mechanical properties (shear modulus and loss angle). The apparatus is designed to provide cure data on curable articles such as rubber products and components in situ, during the curing of the article, to improve manufacturing cure efficiencies. The curometer is a small-scale version of an Oscillating Disk Rheometer, designed to operate through a mold wall. An approximate theoretical treatment has been developed to relate the observed torque and loss angle to the dynamic properties of the rubber compound. <IMAGE>