Substrate for electrical circuit board consisting of copper- and ceramic layers.

摘要

The invention relates to a multilayer substrate, consisting of copper and ceramic layers, for electrical printed-circuit boards, in which (substrate) the layers respectively formed from a copper sheet or a ceramic plate are joined to one another using the DBC process in order to form the multilayer substrate, which has at least one layer sequence consisting of at least two layers. …It is characteristic of the invention that the layer sequence is constructed as a hollow profile in which the at least two layers of the layer sequence are provided essentially parallel to, and at a distance from, one another. ……