发明名称 Semiconductor power module.
摘要 In a semiconductor power module, a surge voltage on a power source line of a semiconductor element for electric power control is restrained. A power source terminal PS(NP) is comprised of power source terminals PS(P) and PS(N) which are arranged adjacent each other through a plate-like insulative sheet INS1 made of insulative synthetic resin or the like sandwitched therebetween. The power source terminals PS(P) and PS(N) are each formed by a conductive plate and respectively transmit a positive and a negative power source potentials. The thickness of the insulative sheet INS1 is 0.5 mm to 1.5 mm, for instance. A reduction is made in a parasitic inductance which is present in the power source line which extends from the power source terminal PS(P) to the power source terminal PS(N) through the semiconductor element for electric power control, thereby suppressing a surge voltage which is developed between the power source terminal PS(P) and the power source terminal PS(N). <IMAGE>
申请公布号 EP0578108(A1) 申请公布日期 1994.01.12
申请号 EP19930110363 申请日期 1993.06.29
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 NAGATOMO, AKIHIRO;YOSHIDA, HIROSHI C/O FUKURYO SEMICONDUCTOR EN. CO.;NISHIYAMA, MASAKI C/O FUKURYO SEMICONDUCTOR;OSHIMA, SEIISHI C/OMITSUBISHI DENKI K.K.
分类号 H01L23/62;H01L23/50;H01L23/64;H01L25/07;H01L25/16;H01L25/18;H02M7/00 主分类号 H01L23/62
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