发明名称 |
Method for manufacturing field emission display |
摘要 |
A field emission display FED is manufactured by a method for manufacturing the FED comprising the steps of forming successively a conductive coating and first photoresist coating on a transparent insulating substrate; exposing the first photoresist coating to the light and removing it except a part where a microtip is formed; etching in a predetermined depth the conductive coating using the first photoresist pattern as a mask to form a plurality of columns; depositing an insulating coating on the etched and exposed conductive coating and removing the remaining first photoresist pattern by a lift off method; depositing and patterning a second photoresist coating on the exposed column and the insulating coating to form a second photoresist pattern in order that the thickness of the remaining second photoresist coating becomes smaller than that of the exposed column; etching the column through a selective isotropic or anisotropic etching process using the second photoresist pattern as the mask to form the sharp end of the microtip; and depositing a gate layer on the insulating coating and removing the remaining second photoresist pattern. As a result, the end of the microtip is formed under the surface of the gate so as to be less influenced by an ion bombardment thereby reducing the abrasion of the microtip.
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申请公布号 |
US5277638(A) |
申请公布日期 |
1994.01.11 |
申请号 |
US19920991861 |
申请日期 |
1992.12.15 |
申请人 |
SAMSUNG ELECTRON DEVICES CO., LTD. |
发明人 |
LEE, KANGOK |
分类号 |
G09F9/313;H01J9/02;H01J31/12;(IPC1-7):H01J9/02 |
主分类号 |
G09F9/313 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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