| 摘要 |
PURPOSE:To obtain composite, which is favorable in adhesion and planar shape, by a method wherein aromatic polyamide film, which contains bonding unit represented by the specified general formula and the density and product of thermal shrinkage factor and thermal expansion coefficient in the plane of film of which are respectively specified, and metal are compounded. CONSTITUTION:The aromatic polyamide film composite concerned is made by compounding specified aromatic polyamide film and metal. In this case, the specified aromatic polyamide film contains 50mol.% or more of bonding unit represented by the separately shown general formula, in which (m) and (n) are integers of one to four and, at the same time, m+nnot equal to 0. The density of polymer only is substantially set to be 1,490g/cm<3> or more. Further, the product of the thermal shrinkage factor and thermal expansion coefficient to at least one direction in the plane of film is set to lie within the range of 1.0X10<-7>-1.0X10<-4> [(mm/mm/ deg.C)X(%)]. Thus, neither curling nor wrinkle can develop and composite, which is excellent in humid characteristics and adhesion properties and favorable in planar shape, is obtained. |
