发明名称 Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate
摘要 A method for producing a thin film multilayer substrate having a base substrate, and, which a plurality of conductor pattern layers superposed thereon through dielectric layers therebetween comprises the steps of: optically detecting the uppermost conductor pattern layer whenever the conductor pattern layer is formed on the base substrate; inspecting an absence and/or presence of a fault of the conductor pattern layer; and repairing a faulty portion in accordance with fault position data detected by the inspecting. According to this method, it is possible to enhance a production yield of relatively large size of thin film multilayer substrates which needs a relatively small amount of production at a high production cost, for mounting LSI chips thereon.
申请公布号 US5278012(A) 申请公布日期 1994.01.11
申请号 US19920938516 申请日期 1992.09.02
申请人 HITACHI, LTD. 发明人 YAMANAKA, CHIE;ICHINOSE, TOSHIAKI;NINOMIYA, TAKANORI;IWATA, HISAFUMI;NAKAGAWA, YASUO;AKIYAMA, NOBUYUKI
分类号 G01N21/956;H01L21/00;H01L21/48;H01L21/66;H05K3/22;(IPC1-7):G01N21/88;G01N21/64 主分类号 G01N21/956
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