发明名称 |
Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate |
摘要 |
A method for producing a thin film multilayer substrate having a base substrate, and, which a plurality of conductor pattern layers superposed thereon through dielectric layers therebetween comprises the steps of: optically detecting the uppermost conductor pattern layer whenever the conductor pattern layer is formed on the base substrate; inspecting an absence and/or presence of a fault of the conductor pattern layer; and repairing a faulty portion in accordance with fault position data detected by the inspecting. According to this method, it is possible to enhance a production yield of relatively large size of thin film multilayer substrates which needs a relatively small amount of production at a high production cost, for mounting LSI chips thereon.
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申请公布号 |
US5278012(A) |
申请公布日期 |
1994.01.11 |
申请号 |
US19920938516 |
申请日期 |
1992.09.02 |
申请人 |
HITACHI, LTD. |
发明人 |
YAMANAKA, CHIE;ICHINOSE, TOSHIAKI;NINOMIYA, TAKANORI;IWATA, HISAFUMI;NAKAGAWA, YASUO;AKIYAMA, NOBUYUKI |
分类号 |
G01N21/956;H01L21/00;H01L21/48;H01L21/66;H05K3/22;(IPC1-7):G01N21/88;G01N21/64 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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