发明名称 EVALUATING METHOD FOR PRINTED WIRING BOARD
摘要 PURPOSE:To positively detect even a small failure with a short measurement. CONSTITUTION:Each measurement point of a printed wiring board 4 loaded into a thermal shock testing machine 3 is connected to a scanner 8 and the output terminal of the scanner 8 is connected to a resistance meter 9. Also, switching of each measurement point is controlled by a controller 10A. While the resistance of each measurement point is measured continuously, thermal stress is applied to the printed wiring board 4. When thermal stress is applied, a thermal stress with an abrupt negative temperature difference (-DELTAt) is applied or that with an abrupt positive temperature difference (+DELTAt) is applied while executing continuous continuity test of a conductor.
申请公布号 JPH063399(A) 申请公布日期 1994.01.11
申请号 JP19920158111 申请日期 1992.06.17
申请人 FUJITSU LTD 发明人 FURUKAWA HIROSHI;OKAZAKI MAKOTO;YOSHIZAWA AKIRA;AKUTSU RIICHI
分类号 G01R31/02;G06T1/00;H05K3/00;H05K3/46 主分类号 G01R31/02
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