发明名称 Semiconductor contact with discontinuous noble metal
摘要 A semiconductor device with a monocrystalline silicon body (1) is provided with a dielectric layer (2) with contact holes (3) through which the silicon body (1) is contacted with an aluminum metallization. To avoid undesirable separation of silicon, a discontinuous nucleus layer (5) of a metal nobler than silicon is formed on the silicon body (1) in the contact holes (3) preceding the provision of the metallization (4). Metals such as palladium and copper may be used to form the discontinuous layer.
申请公布号 US5278450(A) 申请公布日期 1994.01.11
申请号 US19920818004 申请日期 1992.01.08
申请人 U.S. PHILIPS CORPORATION 发明人 WOLTERS, ROBERTUS A. M.;SWART, EDWIN T.;VAN DER PUTTEN, ANDREAS M. T. P.
分类号 H01L21/28;H01L21/285;H01L21/288;H01L21/768;H01L23/532;(IPC1-7):H01L23/48;H01L29/46;H01L29/54;H01L29/62 主分类号 H01L21/28
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