发明名称 |
High density electrical interconnection device and method therefor |
摘要 |
A high density electrical interconnection device provides a uniform complementary pattern of thieving lines on both X and Y interconnect layers of the high density device to provide for uniform plating of the copper conductors, as well as reducing both nonuniformity and the amount of contraction and expansion of the insulating substrate. The complementary line pattern of thieving lines is generated by computer-aided design techniques and also includes provisions for gaps in thieving lines in one layer so as to eliminate crossover coupling with another layer and provides for visual identification of the thieving lines by the use of an undulating pattern.
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申请公布号 |
US5278727(A) |
申请公布日期 |
1994.01.11 |
申请号 |
US19920859288 |
申请日期 |
1992.03.25 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
WESTBROOK, SCOTT M.;HOWELL, GELSTON |
分类号 |
H01L23/538;H05K1/00;H05K1/02;H05K1/18;H05K3/00;H05K3/46;(IPC1-7):H05K1/03;H05K1/11 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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