摘要 |
The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
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申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ACOCELLA, JOHN;AGOSTINO, PETER A.;BAISE, ARNOLD I.;BATES, RICHARD A.;BRYANT, RAY M.;CASEY, JON A.;CLARKE, DAVID R.;CZORNYJ, GEORGE;DAM, ALLEN J.;DAVID, LAWRENCE D.;DIVAKARUNI, RENUKA S.;DUNKEL, WERNER E.;GIRI, AJAY P.;HSIA, LIANG-CHOO;HUMENIK, JAMES N.;KANDETZKE, STEVEN M.;KIRBY, DANIEL P.;KNICKERBOCKER, JOHN U.;KNICKERBOCKER, SARAH H.;MASTREANI, ANTHONY;MATTS, AMY T.;NUFER, ROBERT W.;PERRY, CHARLES H.;REDDY, SRINIVASA S. N.;SCILLA, SALVATORE J.;TAKACS, MARK A.;WIGGINS, LOVELL B. |