| 摘要 |
The invention is an abrasive fluid cutting composition comprising a carrier fluid, and an abrasive. Preferably, the composition may also include a surface active agent. The invention also comprises a method for removing material from a substrate through application of the abrasive fluid of the invention comprising the steps of projecting the fluid composition onto the substrate. Reactive materials such as explosives, propellants, flammables, combustibles and the like may be cut using the composition of the invention.
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