| 摘要 |
<p>Device for heating an object, in particular a wafer of semiconductor material, comprising: a chamber (2) in which the object for heating can be placed and which is provided with a wall permeable to radiation in a determined wavelength range; heating elements (3) for heating the object in the chamber; first radiating elements (5) for projecting radiation onto the object; means for modulating the intensity of the radiation coming from the first radiating elements; a radiation meter (6) for measuring the radiation intensity generated by the object, the sensitivity of which is located for a significant part in said wavelength range; and filtering means (4) for filtering in said wavelength range radiation coming from the heating means and/or parts heated by the heating means, wherein the filtering means are disposed such that radiation from the modulated first radiating elements reaches the radiation meter unfiltered.</p> |
