发明名称 |
DEVICE FOR CORRECTING LATERAL BENDING OF IC LEADS |
摘要 |
<p>A device for correcting the lateral bending of IC leads including a mold having comb-shaped pawls which are inserted into respective gaps between IC leads, wherein each of the comb-shaped pawls of the mold includes a contact member which is contacted with only the end portion of each IC lead, the end portions of the IC leads being pushed and spread out in a lateral direction by the contact members of the pawls when the pawls of the mold are inserted into the gaps. Each of the contact members is designed in a wedge shape.</p> |
申请公布号 |
GB9322987(D0) |
申请公布日期 |
1994.01.05 |
申请号 |
GB19930022987 |
申请日期 |
1993.11.05 |
申请人 |
SANYO SILICON ELECTRONICS CO LTD |
发明人 |
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分类号 |
B21D3/10;H01L23/50;H05K13/00 |
主分类号 |
B21D3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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