| 摘要 |
<p>A given testing substrate (20) for fast-testing many integrated-circuit electronic devices (e.g., 10), one after the other, has a set of mutually insulated corrugated wiring areas (30) that can be aligned with solder-bump I/O pads (13) of the electronic devices. At the surface of each of the corrugated areas is located a layer (23) that is an electrically conductive durable oxide, or that is itself durable, electrically conductive, and non-oxidizable. During testing, the solder-bump I/O pads of the electronic device being tested are aligned with and pressed against the corrugated wiring areas of the given substrate. Alternatively, the electronic devices being of the electrically programmable variety, such as EPROMS, programming voltages can be delivered to each of the devices, one after the other, through the corrugated wiring areas of a single substrate. <IMAGE></p> |
