| 摘要 |
It is proposed to adhesively bond the support surface (28) of the sensor (8) constructed as a glass/silicon/glass layer structure (packet), in the silicon layer of which a flexural vibrator (37, 38, 39) is constructed, only partly, actually using an accurately defined adhesive-bonding surface (33), to the support. The adhesive-bonding surface (33) is obtained and creep of adhesive is avoided in regions of the supporting surface (29) of the sensor (8) lying outside the adhesive-bonding surface (33) by applying at least one groove (31) in the supporting surface (28). <IMAGE> |
