发明名称 System for contactless continuous measurement of substrate thickness - has laser generating diffused light from substrate sensed by CCD camera under positional control of eddy current sensor and piezo-actuator
摘要 An apparatus for the contactless and continuous measurement of the thickness of a thin substrate supported by the reference surface (5) of a conveyor roller (10) eg during paper/cardboard manufacture projects a focussed laser (1) beam normal to the paper surface (P) via the optical system (2). A proportion of the diffused light flux travels to an optical receiver (6) and is registered by eg a CCD line camera for evaluation by the unit (8). A fixed clearance of 0.2 to 0.3 mm between the projector optics (2) and reference surface (5) is rigidly maintained by the eddy current sensor coils (12, 13) whose signals control the piezo-electric or magnetostrictive actuator stem (3). USE/ADVANTAGE - Enables accurate and contactless measurements of thickness in order of 1 to 2 microns on high-speed production lines operating at 2000 metres/min.
申请公布号 DE4221031(A1) 申请公布日期 1994.01.05
申请号 DE19924221031 申请日期 1992.06.26
申请人 J.M. VOITH GMBH, 89522 HEIDENHEIM, DE 发明人 MITTAG, JUERGEN, 7920 HEIDENHEIM, DE
分类号 D21F7/06;G01B7/02;G01B11/06;G01B21/08;(IPC1-7):G01B11/06;G01B7/14;G01B21/16;G12B1/00 主分类号 D21F7/06
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