Method of manufacturing a multilayer circuit board

摘要

Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. The circuits each include a layer of a noble metal at, at least, selected exposed locations. Once stacked the circuits are subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and diffuse conductive layers together to form an integral multilayer circuit having solid conductive interconnects.