发明名称 Method for encapsulating electronic devices
摘要 A silicone gel encapsulated integrated circuit (12) is placed in a container, the container being partially filled with a silicone elastomer (16) which is much more rugged than the gel. After the elastomer (16) hardens, it completely covers the gel encapsulation (14) and protects it and the integrated circuit device from the effects of rough handling. The gel, however, gives all of the protection from the external environment that it would in the absence of the elastomer encapsulation.
申请公布号 US5275841(A) 申请公布日期 1994.01.04
申请号 US19920921654 申请日期 1992.07.30
申请人 AT&T BELL LABORATORIES 发明人 WONG, CHING-PING
分类号 H01L23/29;H01L23/31;(IPC1-7):B05D5/12 主分类号 H01L23/29
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