Method of manufacturing ceramic multilayer electronic component

摘要

A ceramic green sheet is formed on a carrier film; both the ceramic green sheet and the carrier film are cut into prescribed dimensions; a hole to serve as a via hole is provided in the ceramic green sheet while the ceramic green sheet is maintained in the state backed with the carrier film; the hole is filled up with a conductive paste while the ceramic green sheet is in this state; an interconnection pattern is formed on the ceramic green sheet which is still backed up with the carrier film; and the ceramic green sheet is then separated from the carrier film and is then immediately stacked in order on other ceramic green sheets. Thus, it is possible to improve the accuracy in stacking of ceramic green sheets in a method of manufacturing a ceramic multilayer circuit board having portions electrically connected through via holes.