| 摘要 |
PURPOSE:To easily and highly accurately manufacture a resin-molded part, on one surface of which a board is precisely positioned, by a method wherein the board is set in a mold, which has rail-shaped projections for positioning the board nd, after that, resin is injected in the mold. CONSTITUTION:The manufacture of an IC card is taken for example; firstly, a printed wiring board 2 having an IC module 10 thereon is set in a lower mold 12 having rail-shaped projections (in the direction perpendicular to the page). Secondly, an upper mold 11 is put on the mold 12 so as to inject resin in the molds 11 and 12 in order to mold a card substrate 13. The board 2 can be easily and highly accurately set. The board 2 may be set by suction through a suction hole 12b provided on the lower mold. |
