发明名称 |
Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material |
摘要 |
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board. |
申请公布号 |
US5275975(A) |
申请公布日期 |
1994.01.04 |
申请号 |
US19920907258 |
申请日期 |
1992.07.01 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BAUDOUIN, DANIEL A.;RUSSELL, ERNEST J. |
分类号 |
H01L23/495;H05K3/30;(IPC1-7):H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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