Flexible substrate electronic assembly

摘要

A unitary flexible substrate has three planar areas with components and conductors carried thereon. The substrate is folded to provide a subassembly with a compact packaging factor such that each planar area is in a different parallel plane. Two conductor-carrying projections of the substrate extend from different end portions of the substrate to free distal ends of the projections which are positioned adjacent to each other. The projection conductors, at the projection distal ends, are soldered to each other to provide a more direct, low resistance electrical connection between conductors on the substrate end portions. Heat sink rigidizer plates are attached to each of the three planar substrate portions. One rigidizer plate is thermally and planarly coupled to a metal heat sink cover of a protective housing for the folded subassembly. The other rigidizer plates are planarly bonded to each other to form a unitary support structure for two of the planar substrate portions.