Chip card structure.

摘要

The invention relates to the manufacturing of chip cards. …These cards (10) are flat and subjected to high flexural and torsional deformations when the user does not take special operating precautions. A micromodule (14) is housed in a cavity (12) in the card and this micromodule is fixed by natural adhesion between the plastic material of the bottom of the cavity and the resin coating the integrated circuit of the micromodule. In order to avoid the micromodule being torn away when flexing the card, at least one overhang (26) is provided via which the upper surface of the card will overlap an edge of the micromodule in order to limit the latter's displacements. ……