发明名称 CONNECTING STRUCTURE OF ELECTRIC CIRCUIT BOARD AND CONNECTING METHOD THEREFOR
摘要 PURPOSE:To electrically connect with high reliability by interposing insulating particles between electrodes of first, second electric circuit boards. CONSTITUTION:A second electric circuit board 2 is held fixedly to a first electric circuit board 1 with adhesive (e.g. ultraviolet curable adhesive) 3, and electrodes 1a, 2a of the boards 1, 2 are electrically connected therebetween, for example, with conductive particles 4 covered with conductive members 4b made of nickel, gold, platinum, etc. In this case, an insulator 5 made of elastic material 4a such as polystyrene, silicone rubber, styrene-butadiene rubber, thermoplastic polyester, epoxy resin, urethane resin, etc., is interposed between the electrodes 1a and 2a of the boards 1, 2. Thus, collapsing width of the particles 4a is suitable, they can be connected with a predetermined connecting thickness, and electric connection with high reliability can be performed.
申请公布号 JPH05347464(A) 申请公布日期 1993.12.27
申请号 JP19920156352 申请日期 1992.06.16
申请人 RICOH CO LTD 发明人 KOBAYASHI HIROSHI
分类号 H01B5/16;H01R11/01;H05K1/14;H05K3/32;H05K3/36 主分类号 H01B5/16
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