| 摘要 |
PURPOSE:To improve heat release by including diamond particle in aluminum, iron, tungsten, etc., only or an alloy thereof, ceramic and synthetic resin. CONSTITUTION:Diamond particle is included in aluminum or aluminum alloy of an electronic component radiation fin to improve heat dissipation efficiency and to reduce a size and weight. Iron or iron alloy whereto diamond particle is included is used for a semiconductor device lead frame, engine, a cooling pipe, etc., of a power generation device to improve heat dissipation efficiency or heat conversion efficiency. Diamond particle is included in tungsten and molybdenum for a semiconductor device pedestal during powder sintering to improve heat dissipation efficiency and heat conversion efficiency. Diamond particle is included and baked during formation of a green sheet of alumina, aluminum nitride ceramic to improve the thermal conductivity and heat dissipation efficiency of a printed substrate. Diamond particle is included in filler of epoxy resin or a glass coating is applied to a surface thereof by CVD method, etc., to improve the thermal conductivity of a printed substrate. |
