| 摘要 |
PURPOSE:To miniaturize a light-emitting device, and to prevent the temperature rise of a light-emitting element due to the heat generation by a resistor in the light-emitting device, in which the light-emitting element and the resistor are connected in series. CONSTITUTION:A package 11 is formed through an MID method, a light-emitting element 12 is loaded on the top face of the package 11, a resistor 13 is loaded on the underside of the package 11, and each part is changed into one chip as much as possible, thus miniaturizing a light-emitting device. Each wiring section, on which the light-emitting element 12 and the resistor 13 are loaded, is not continued, and connection between both the light-emitting element 12 and the resistor 13 is limited in a metallic small-gage wire 33, thus preventing conduction through the light-emitting element 12 of heat from the resistor 13. |
