发明名称 MANUFACTURE OF CIRCUIT BOARD
摘要 PURPOSE:To prevent that the surface of a circuit pattern is damaged when a circuit board is irradiated with a UV-region laser beam and it is worked fine and to prevent that a resin-decomposed substance adheres to the circuit hoard. CONSTITUTION:A circuit board in which circuit patterns 12 have been formed on one face or on both faces of an insulating resin layer 1 is irradiated with a high-energy UV-region laser beam; a hole part 4 is formed in the insulating resin layer 1. Before that, cover resin layers 3 are formed on the surface of the circuit patterns 12. Alternatively, as another manufacturing method, protective metal layers can be formed on the surface of the circuit patterns 12.
申请公布号 JPH05343828(A) 申请公布日期 1993.12.24
申请号 JP19920178981 申请日期 1992.06.11
申请人 NITTO DENKO CORP 发明人 KANETO MASAYUKI;SUGIMOTO MASAKAZU;MORITA NAOHARU
分类号 H05K3/00;B23K26/00;B23K26/38 主分类号 H05K3/00
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