| 摘要 |
<p>PURPOSE:To reduce the substantial influence of the contamination of a semiconductor wafer and to align the center of a chuck main body with the center of the semiconductor wafer. CONSTITUTION:A chuck for wafer use is provided with a disk-shaped chuck main body 1 which sucks and fixes a semiconductor wafer W. In the chuck for wafer use, at least three support bodies 5 which are provided with the following are separated at equal intervals in the circumferential direction at the peripheral edge part of the chuck main body: stepped support faces 3 which support the peripheral edge part of the semiconductor wafer; and sliding faces 4 which are connected to the stepped support faces and which are tilted in such a way that the outer circumferential side of the chuck main body becomes high. In addition, the support bodies 5 are installed so as to be capable of being projected from, and retreated into, a chuck face 2. Thereby, the semiconductor wafer comes into contact with the support bodies at the peripheral edge part of the semiconductor wafer, and the semiconductor wafer is moved to the center side of the chuck main body due to its own weight along the sliding faces when the semiconductor wafer is transferred to the chuck main body.</p> |
