| 摘要 |
<p>PURPOSE:To constitute a die bonding apparatus wherein its repetitive work time for a connection by means of a heating and pressure bonding operation is short and its alignment accuracy of a connecting object with an object to be connected is high in the bonding apparatus wherein it sucks the connecting object, it recognizes the position of the object to be connected, which is faced with the connecting object, it aligns the connecting object with the object to be connected and it connects the connecting object to the object to he connected by means of the heating and pressure bonding operation. CONSTITUTION:An apparatus is provided with the following: a pickup collet 9 which sucks and picks up a connecting object 1; a transfer stage 10; and a bonding collet 21 which sucks the connecting object 1 by means of the transfer stage 10 and which pressure-bonds the connecting object 1 to an object 15 to be connected. In the apparatus, both collets can be operated in parallel, heating heaters are installed on the side of the bonding collet 21 and on the side of the object 15 to be connected, and the connecting object 1 can be aligned with the object to be connected after they have been heated and their temperatures have been raised.</p> |
